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INTEGRATED CIRCUITS
DATA SHEET
TDA8601 RGB/YUV and fast blanking switch
Product specification Supersedes data of July 1994 File under Integrated Circuits, IC02 1996 Jun 27
Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
FEATURES * YUV/RGB and fast blanking switch * 3-state output * Selectable clamp: - passive (with diodes) or - active clamp * Bandwidth greater than 22 MHz * Fully ESD protected * Latch-up free. APPLICATIONS * Standard and high definition television sets * Peri-television sets. QUICK REFERENCE DATA SYMBOL VP Gv B ct Tamb PARAMETER supply voltage voltage gain bandwidth crosstalk attenuation between two video channels operating ambient temperature at 3 dB fi = 5 MHz CONDITIONS MIN. 7.2 -0.5 22 -60 0 0 - - - TYP. 8.0 GENERAL DESCRIPTION
TDA8601
The device is intended for switching between two RGB or YUV video sources. The outputs can be set to a high-impedance state to enable parallel connection of several devices. A HIGH level on SEL (pin 5) selects the video inputs of Channel 2. The IOCNTR control pin (pin 16) defines the 3-state outputs and clamp inputs: * HIGH = 3-state outputs (also for test; active clamp) * LOW = passive clamp at the video inputs (diode) * Sandcastle: the video signal is clamped with an active clamp during the sync pulse.
MAX. 8.8 +0.5 - - 70
UNIT V dB MHz dB C
ORDERING INFORMATION TYPE NUMBER TDA8601 TDA8601T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 3.9 mm VERSION SOT38-1 SOT109-1
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
BLOCK DIAGRAM
TDA8601
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
PINNING SYMBOL VP VIDIa1 VIDIb1 VIDIc1 SEL VIDIa2 VIDIb2 VIDIc2 GND VIDOc VIDOb VIDOa FBO FBI2 FBI1 IOCNTR PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION supply voltage (8 V) video input a (channel 1) video input b (channel 1) video input c (channel 1) channel selection video input a (channel 2) video input b (channel 2) video input c (channel 2) ground video output c video output b video output a fast blanking output signal fast blanking input signal (channel 2) fast blanking input signal (channel 1) control of video input or video output Fig.2 Pin configuration.
TDA8601
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Vi Tj Tstg HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. ESD in accordance with "MIL STD 883C" - "Method 3015": 1. Human body model: 1500 , 100 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. Class 2: 2000 to 3999 V. 2. Machine model: 0 , 200 pF, 3 pulses positive and 3 pulses negative on each pin with respect to ground. The IC withstands 200 V. supply voltage input voltage (pins 2 to 4 and 6 to 8) referenced to ground junction temperature IC storage temperature PARAMETER 0 - -55 MIN. -0.3 MAX. +12 8.8 150 +150 V V C C UNIT
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
THERMAL CHARACTERISTICS SYMBOL Rth j-a DIP16 SO16 PARAMETER thermal resistance from junction to ambient in free air 70 115 VALUE
TDA8601
UNIT K/W K/W
OPERATING CHARACTERISTICS The operating characteristics are the conditions within the IC when it is functional; these conditions can have any value. For example, condition VIL (pin 5) is fixed at 0.5 V. The IC will then operate over the full temperature range and supply voltage range. SYMBOL Supply VP Vi(p-p) supply voltage 7.2 - - 8.0 8.8 V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Video inputs (pins 1 to 3 and 6 to 8) input video signal amplitude (peak-to-peak value) R, G, B signals Y signal; active clamp 0.7 1 1.05 1.33 47 - - - - - - - 3.6 2.5 - - 1 1.4 1.5 1.9 - V V V V nF
-(B - Y) signal; active clamp - -(R - Y) signal; active clamp - Ci VIH VIL VIH VIL Vsc input clamp capacitor IIH = 10 A IIL = -10 A IIH = 10 A IIL = -10 A zero level blanking level clamp level tW clamp pulse width SECAM mode PAL mode Fast blanking inputs (pins 14 and 15) VIH VIL CL RL HIGH level input voltage LOW level input voltage 0.95 - - note 1 1 - Control inputs (pins 5 and 16) HIGH level input voltage (pin 5) LOW level input voltage (pin 5) HIGH level input voltage (pin 16) LOW level input voltage (pin 16) sandcastle input voltage level (pin 16) 0.9 - 2.0 - - 2.0 3.9 - -
VP 0.5 VP 0.8 1.1 3.1 5.5 - -
V V V V V V V s s
VP 0.5
V V
Video outputs (pins 10 to 12) output load capacitor output load resistor 40 - 100 - pF k
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL
PARAMETER
CONDITIONS - note 1 1
MIN.
TYP.
MAX.
UNIT
Fast blanking output (pin 13) CL RL Note 1. For the DIP16 package, the thermal resistance is lower. The minimum value for the output load resistor is 270 . CHARACTERISTICS The typical values are given for VP = 8 V; Tamb = 25 C. CL = 40 pF; no load resistor; measured in application circuit of Fig.8 over full supply voltage and temperature range; unless otherwise specified. SYMBOL Supply IP SVRR supply current supply voltage rejection ratio no resistive load on the outputs fi = 40 Hz to 50 kHz; note 1 fi = 40 Hz; note 1 Video inputs (pins 1 to 3 and 4 to 6) Ri Ci(max) Vclamp input resistance maximum input capacitance input clamping voltage level Ii = -50 mA; passive clamp Ii = 50 mA; active clamp; VIOCNTR = 3.9 V Ii = -50 mA; active clamp; VIOCNTR = 3.9 V Isink Iclamp input sink current Vi = 2 V; passive clamp maximum absolute input clamping Vi = Vclamp + 0.5 V; current active clamp for each type of clamp 10 - 1.05 2.05 2.05 0.5 200 - 3 1.21 2.42 2.37 1.6 - - - 1.35 2.70 2.70 3 - k pF V V V A A - - - 33 - -51 40 -36 -36 mA dB dB PARAMETER CONDITIONS MIN. TYP. MAX. UNIT output load capacitor output load resistor 40 - 100 - pF k
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL
PARAMETER
CONDITIONS - 3-state output 3-state output fi = 1 MHz at 0.5 dB at 1 dB at 3 dB
MIN. - - 3 0 - -
TYP.
MAX.
UNIT M pF dB MHz MHz MHz dB dB dB dB dB dB V/s dB
Video outputs (pins 10 to 12) Ro RoZ CoZ(max) Gv B output resistance output resistance maximum output capacitance voltage gain bandwidth 50 - - +0.5 - - - - - - - - - - 0.5 0.1 - -0.5 5 10 22 -60 -50 -40 -60 -50 -40 100 fi = 5 MHz -
40 - - - - - - 120 -
ct
crosstalk attenuation between two fi = 5 MHz; note 2 video channels fi = 10 MHz; note 2 fi = 22 MHz; note 2 isolation of the 3-state configuration fi = 5 MHz; note 2 fi = 10 MHz; note 2 fi = 22 MHz; note 2
off
SR Gm
slew rate gain matching between two different signals of the same channel output blanking level voltage output blanking offset voltage Vi(ch1) = 0.7 V (p-p) (white); Vi(ch2) = 0 V (p-p) (black); active clamp; note 3 Vi(ch1) = 0.7 V (p-p) (white); Vi(ch2) = 0 V (p-p) (black); passive clamp; note 3
Vo(bl) Vos(bl)
2.1 -
2.23 -
2.7 5
V mV
-
-
15
mV
Vos(bl)
matching of output blanking offset voltage
Vi(ch1) = 0.7 V (p-p) (white); Vi(ch2) = 0 V (p-p) (black); active clamp; note 3 Vi(ch1) = 0.7 V (p-p) (white); Vi(ch2) = 0 V (p-p) (black); passive clamp; note 3
-
-
5
mV
-
-
5
mV
Fast blanking inputs (pins 14 and 15) Zi VOH VOL Zo Zi input impedance 10 - - k
Fast blanking output (pin 13) HIGH level output voltage LOW level output voltage output impedance 2 0 - 2.35 0.15 - - 3 0.3 50 - V V
SEL input (pin 5) input impedance 10 k
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SYMBOL Timing tdSEL;VID tdSEL;FBO tSWVID tSWFBO tdFB tdVID tdVID tdFB;VID
PARAMETER
CONDITIONS - - - - - - - -
MIN.
TYP.
MAX.
UNIT
delay time between SEL input and note 4 video output delay time between SEL input and note 5 fast blanking output switching time of video output switching time of fast blanking output fast blanking level delay between input and output video delay between input and output delay difference between two video signals at the output delay difference between fast blanking level and video at the output note 4 note 5 note 6 note 7 note 7 note 7
12 15 8.5 8.5 13 4 0.5 5
20 40 15 15 20 20 10 10
ns ns ns ns ns ns ns ns
Notes 1. The supply voltage rejection ratio is measured at the video outputs (pins 10 to 12) when a sine wave is applied on the power supply pin (pin 1); where: VDC = 8 V; Vi = 100 mV (p-p). This additional sine wave on the power supply pin is guaranteed not to cause extraneous oscillations on the video control and fast blanking signals. 2. The 6 video inputs will contain the same signal. The source impedance is 50 . 3. The blanking offset is the level difference between the two channels when they are selected separately and, also, on one video output. This value is measured on each video signal. 4. The delay between the SEL input and the video output together with the switching time of the video output is illustrated in Fig.3. The amplitude of the video signal is 1.9 V (p-p) when the clamp is active and 1.0 V (p-p) when the clamp is passive. 5. The delay between the SEL input and fast blanking output together with the switching time of fast blanking output is illustrated in Fig.4. 6. The fast blanking delay between input and output is illustrated in Fig.5. 7. The video delay between input and output and delay differences are illustrated in Fig.6. Inputs 1 and 2 are either fast blanking input plus a video signal or two video signals. The amplitude of the video signal is 0.5 V (p-p). The video signal levels (i1, i2, o1 and o2) are 50% of the video amplitude. The fast blanking signal levels (i1 and o1) are 0.95 V when the signal rises and 0.5 V when the signal falls.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.3 Timing definition: SEL and VIDO.
Fig.4 Timing definition: SEL and FBO.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.5 Timing definition: fast blanking delay.
Fig.6 Timing definition: video delay.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
INTERNAL PIN CONFIGURATION
TDA8601
Fig.7 Internal pin configuration.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
APPLICATION INFORMATION
TDA8601
Fig.8 Application diagram.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
Fig.9 Schematic diagram of two TDA8601s operating four channels.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA8601
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
TDA8601
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8601
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8601
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
NOTES
TDA8601
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Philips Semiconductors
Product specification
RGB/YUV and fast blanking switch
NOTES
TDA8601
1996 Jun 27
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com/ps/ (1) TDA8601_2 June 26, 1996 11:51 am SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands
537021/25/02/pp20 Date of release: 1996 Jun 27 Document order number: 9397 750 00932

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